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BD429航空串行接口芯片

發(fā)布于:2020-11-04 18:21:36

品牌名稱:DEI

重要參數(shù):

12.5KHz~100KHz數(shù)據(jù)速率

多封裝類型SOIC-16、 CEERDIP-16 、CSOP-16 、CLCC-28

 低EMI 特性

輸入TTL和CMOS 兼容

功率 125mW

工作溫度-55°C~+125°C


  • 產(chǎn)品詳情

BD429 ARINC線路驅(qū)動(dòng)器電路是雙極性單片IC,旨在滿足多種通用航空串行數(shù)據(jù)總線標(biāo)準(zhǔn)的要求。其中包括差分雙極性 RZ 類型,如 ARINC 429、ARINC 571 和 ARINC 575,以及差分 NRZ 類型,如 RS-422 標(biāo)準(zhǔn)。

Part #Temp RangeProduct Package TypeOutput Resistance
BD429-55 to 12516 CERDIP37.5
BD429A1-G-55 to 8516 SOIC WB G37.5
BD429A-G-55 to 8516 SOIC WB G37.5
BD429B-55 to 8528 PLCC37.5
BD429B-G-55 to 8528 PLCC G37.5
BD429-G-55 to 12516 CERDIP G37.5
DEI0429-EES-55 to 8528 CLCC37.5
DEI0429-EMB-55 to 12528 CLCC37.5
DEI0429-EMS-55 to 12528 CLCC37.5
DEI0429-WMB-55 to 12516 CSOP37.5
DEI0429-WMS-55 to 12516 CSOP37.5
DEI1022-G-55 to 8514 SOIC NB G37.5
DEI1023-G-55 to 8514 SOIC NB G37.5
DEI1024-G-55 to 8514 SOIC NB G0
DEI1025-G-55 to 8514 SOIC NB G0
DEI1032-G-55 to 12516 SOIC NB G0
DEI1038-55 to 8528 PLCC13
DEI1038-G-55 to 8528 PLCC G13
DEI1070A-DMB-55 to 1258 SB DIP37.5
DEI1070A-DMS-55 to 1258 SB DIP37.5
DEI1070A-SES-G-55 to 858 EP SOIC G37.5
DEI1070A-SMB-G-55 to 1258 EP SOIC G37.5
DEI1070A-SMS-G-55 to 1258 EP SOIC G37.5
DEI1071A-DMB-55 to 1258 SB DIP10
DEI1071A-DMS-55 to 1258 SB DIP10
DEI1071A-SES-G-55 to 858 EP SOIC G10
DEI1071A-SMB-G-55 to 1258 EP SOIC G10
DEI1071A-SMS-G-55 to 1258 EP SOIC G10
DEI1072A-DMB-55 to 1258 SB DIP0
DEI1072A-DMS-55 to 1258 SB DIP0
DEI1072A-SES-G-55 to 858 EP SOIC G0
DEI1072A-SMB-G-55 to 1258 EP SOIC G0
DEI1072A-SMS-G-55 to 1258 EP SOIC G0
DEI1073A-DMB-55 to 1258 SB DIP37.5
DEI1073A-DMS-55 to 1258 SB DIP37.5
DEI1073A-SES-G-55 to 858 EP SOIC G37.5
DEI1073A-SMB-G-55 to 1258 EP SOIC G37.5
DEI1073A-SMS-G-55 to 1258 EP SOIC G37.5
DEI1074A-DMB-55 to 1258 SB DIP10
DEI1074A-DMS-55 to 1258 SB DIP10
DEI1074A-SES-G-55 to 858 EP SOIC G10
DEI1074A-SMB-G-55 to 1258 EP SOIC G10
DEI1074A-SMS-G-55 to 1258 EP SOIC G10
DEI1075A-DMB-55 to 1258 SB DIP0
DEI1075A-DMS-55 to 1258 SB DIP0
DEI1075A-SES-G-55 to 858 EP SOIC G0
DEI1075A-SMB-G-55 to 1258 EP SOIC G0
DEI1075A-SMS-G-55 to 1258 EP SOIC G0
DEI1170A-MES-G-55 to 8520 5x5 C MLPQ GUser Selectable: 0, 10, 37
DEI1170A-MMS-G-55 to 8520 5x5 C MLPQ GUser Selectable: 0, 10, 37
DEI1171A-MES-G-55 to 12520 5x5 I MLPQ GUser Selectable: 0, 10, 37
DEI1171A-MMS-G-55 to 8520 5x5 I MLPQ GUser Selectable: 0, 10, 37
DEI1270A-MES-G-55 to 8538 5x7 C MLPQ GUser Selectable: 0, 10, 37
DEI1270A-MMS-G-55 to 12538 5x7 C MLPQ GUser Selectable: 0, 10, 37
DEI1271A-MES-G-55 to 8538 5x7 I MLPQ GUser Selectable: 0, 10, 37
DEI1271A-MMS-G-55 to 12538 5x7 I MLPQ GUser Selectable: 0, 10, 37
DEI3182A-CMB-55 to 12516 CERDIP37.5
DEI3182A-CMS-55 to 12516 CERDIP37.5
DEI3182A-DMB-55 to 12516 SB DIP P37.5
DEI3182A-DMS-55 to 12516 SB DIP P37.5
DEI3182A-EMB-55 to 12528 CLCC P37.5
DEI3182A-EMS-55 to 12528 CLCC P37.5
DEI5070-SES-G-55 to 858 EP SOIC G37.5
DEI5070-SMS-G-55 to 1258 EP SOIC G37.5
DEI5071-SES-G-55 to 858 EP SOIC G27.5
DEI5071-SMS-G-55 to 1258 EP SOIC G27.5
DEI5072-SES-G-55 to 858 EP SOIC G7.5
DEI5072-SMS-G-55 to 1258 EP SOIC G7.5
DEI5090-MES-G-55 to 8516 4X4 I MLPQ GUser selectable: 5, 37.5
DEI5090-MMS-G-55 to 12516 4X4 I MLPQ GUser selectable: 5, 37.5
DEI5090-SES-G-55 to 8516 SOIC NB GUser selectable: 5, 37.5
DEI5090-SMS-G-55 to 12516 SOIC NB GUser selectable: 5, 37.5
DEI5097-SES-G-55 to 8516 SOICW I EP G37.5
DEI5270-MES-G-55 to 8538 5x7 I MLPQ GUser selectable: 7.5, 27.5, or 37.5
DEI5270-MMS-G-55 to 12538 5x7 I MLPQ GUser selectable: 7.5, 27.5, or 37.5

DEI 2.png

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